Surface Mount Technology in PCB Assembly

/ / Surface Mount Technology

Have you ever wondered how your electronic gadgets work? Well, their operation is largely dependent upon the kind of printed circuit boards used in their manufacturing, and the method of producing electronic circuits, upon which other components are then mounted. This method is known as Surface Mount Technology and it has effectively replaced the through-hole technology where the components were fitted on to each other via wires passing through punched holes.

Let us tell you more about this technology as it has generated waves in the world of electronics.

Difference between Surface Mount Technology and Through-Hole Technology

An SMT component is normally smaller in size than the through-hole technology because it does not have any leads to take up all the free space. However, it does have small pins of different styles, a matrix of solder balls, and flat contacts where the body of the component ends in order to hold it firmly.

Advantages of Surface Mount Technology

The main advantages of SMT over the older through-hole technique include the fact that due to their small size and work efficiency, they have much higher component density, offering more connections per component. SMTs also have low initial costs and time for production, and fewer holes need to be drilled in the components to make the connections work. SMTs are thus, simpler and faster, giving minor errors, if any at all, during assembly and production.

Furthermore, when it comes to SMTs, the components can be placed on both sides of the circuit board and they have low resistance and inductance levels as well. They also have better mechanical performance under duress, and have an improved EMC performance due to smaller radiation loop areas.

SMT Assembly Types

Listed below are the types of SMT assemblies:

  • Ultra-Fine Ball Grid Array (uBGA)
  • Ball Grid Array (BGA)
  • Quad Flat Pack No-Lead (QFN)
  • Package-On-Package (PoP)
  • Plastic Leaded Chip Carrier (PLCC)
  • Small Outline Integrated Circuit (SOIC)
  • Quad Flat Package (QFP)
  • Small Chip Packages (pitch of 0.2 mm)

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