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Flexible PCB and Rigid-Flex PCB

Rigid-flexible pcb provides a simple means to integrate multiple PCB assemblies and other elements such as display, cables or connectors, input or storage devices without wires, light composites that integrate wiring in ultra-thin, replacing them with thin, flexible ribbons between sections. In rigid-flex packaging, a flexible pcb substrate provides a backbone of wiring with rigid multiplayer circuit sections built-up as modules where needed.

Rigid-flex & Flexible PCB Features:

Flexible PCB Rigid-Flex PCB Manufacturer

Rigid – Flexible PCB Printed Circuit Board

  • 1-30+ Layer Capability
  • IPC 6013 types 1,2,3 & 4
  • Complex balanced & unbalanced structures
  • MIL-SPEC & UL Qualified
  • Acrylic, Epoxy and Adhesiveless Polyimide
  • Silver film & sliver ink EMI shielding
  • Custom Surface Finishes Available
  • Flex Assembly Services
  • Customized Forming and Fitting on Flex

Flexible PCB Electronic devices have taken upon a prominent part of our everyday lives. The extensive range of devices from cell-phones to cameras, regardless of their sizes and uses are now being designed to be flexible, lightweight and efficient. While they all come in diverse shapes, sizes and functionalities, there is one thing in common – they include Flexible PCB boards.

Asia Pacific Circuits produces Flexible PCB and Rigid-Flex PCB for commercial, aerospace and defense markets.

  • Type 1: Single sided flexible pcb material with or without shield(s) or stiffener (one conductive layer).
  • Type 2: Double sided flexible pcb material with or without shield(s) or stiffener (two conductor layers) with plated through holes.
  • Type 3: Multilayer flexible pcb material with or without shield(s) or stiffener (more than two conductor layers) with plated through holes and HDI.
  • Type 4: Multilayer rigid and flexible pcb material combinations (more than two conductor layers) with plated through holes and HDI.

Capability List of Flexible PCB

Material Item Standard Thickness
Substrate Copper Foil Electro Deposited Copper Foil 11.7um 17.5um 35um 70um
Rolled Anneal Copper Foil 11.7um 17.5um 35um 70um
Adhesive Thermosetting Adhesive 12.7um 25.4um 50.8um
Pressure Sensitive Adhesive 12.7um 25.4um 50.8um
Base Film Polymide(PI) 12.7um 25.4um 50.8um 76.2um
Polyester(PET) 12.7um 25.4um 50.8um 76.2um
Solder Mask Coverlay Polymide(PI) 12.7um 25.4um 50.8um
Polyester(PET) 12.7um 25.4um 50.8um
Adhesive Thermosetting Adhesive 12.7um 25.4um 50.8um
Pressure Sensitive Adhesive 12.7um 25.4um 50.8um
SolderMask UV Cure 10um — 20um
Thermal Post Cure 10um — 20um
Stiffener Material FR4 200um-1600um
Polymide(PI) 12.7um 25.4um 50.8um
Polyester(PET) 2.54um 3.81um 4.78um
Stainless Steel 150um 200um
Adhesive Thermosetting Adhesive 12.7um 25.4um 50.8um
Pressure Sensitive Adhesive 12.7um 25.4um 50.8um
TECHNOLOGY SPECIFICATIONS
Process Item Size & Thickness Tolerance & Remarks
Drill Min hole size (mechanical) 0.15mm ±0.05mm(H≤1.5mm)
Min hole size (laser) <0.15mm
Min hole size (punch) 0.50mm ±0.05mm(H≤1.5mm)
Pattern
Transfer
Min line width 0.05mm ±0.02mm(W≤0.05mm)
Min line gap 0.05mm ±0.02mm(W≤0.05mm)
Panel Max board size 250*500mm ±0.07mm(L≤50mm)
Surface
Treatment
Flash Gold 0.2um — 3um
Immersion Gold 0.025 — 0.075mm
Tin Plating 0.2um — 10um
Immersion Tin 0.025um — 0.075um
Tin/lead Plating 0.05um — 10um
OSP 0.2um — 0.5um
HAL 0.075um — 5um
Parameter Insulation Resistance 1000m IPC-TM-650.2.6.3.2
Dielectric Strength 5KV IPC-TM-650.2.5.6.1
Surface Resistance 5*1012Ω  ‖  5*1015Ω IPC-TM-650.2.5.17
Body Resistance Value 1*1015Ω  ‖  1*1015Ω IPC-TM-650.2.5.17
Dielectric Constant 4.0  ‖  3.0 MIL-P-55617
Transpiration Coefficient 0.04  ‖  0.03 MIL-P-55617
Peeling Strength 1.0 kg f/cm  ‖  1.2 kg f/cm IPC-TM-650.2.4.9
Solder Heat Resistance 300 ℃/10sec  ‖  210 ℃/10sec
Flammability Retardant 94VTM-O  ‖  94VTM-O U194

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