Flexible PCB and Rigid-Flex PCB
Rigid-flexible pcb provides a simple means to integrate multiple PCB assemblies and other elements such as display, cables or connectors, input or storage devices without wires, light composites that integrate wiring in ultra-thin, replacing them with thin, flexible ribbons between sections. In rigid-flex packaging, a flexible pcb substrate provides a backbone of wiring with rigid multiplayer circuit sections built-up as modules where needed.
Rigid-flex & Flexible PCB Features:
- 1-30+ Layer Capability
- IPC 6013 types 1,2,3 & 4
- Complex balanced & unbalanced structures
- MIL-SPEC & UL Qualified
- Acrylic, Epoxy and Adhesiveless Polyimide
- Silver film & sliver ink EMI shielding
- Custom Surface Finishes Available
- Flex Assembly Services
- Customized Forming and Fitting on Flex
Flexible PCB Electronic devices have taken upon a prominent part of our everyday lives. The extensive range of devices from cell-phones to cameras, regardless of their sizes and uses are now being designed to be flexible, lightweight and efficient. While they all come in diverse shapes, sizes and functionalities, there is one thing in common – they include Flexible PCB boards.
Asia Pacific Circuits produces Flexible PCB and Rigid-Flex PCB for commercial, aerospace and defense markets.
- Type 1: Single sided flexible pcb material with or without shield(s) or stiffener (one conductive layer).
- Type 2: Double sided flexible pcb material with or without shield(s) or stiffener (two conductor layers) with plated through holes.
- Type 3: Multilayer flexible pcb material with or without shield(s) or stiffener (more than two conductor layers) with plated through holes and HDI.
- Type 4: Multilayer rigid and flexible pcb material combinations (more than two conductor layers) with plated through holes and HDI.
Capability List of Flexible PCB
Material | Item | Standard Thickness | ||||
Substrate | Copper Foil | Electro Deposited Copper Foil | 11.7um | 17.5um | 35um | 70um |
Rolled Anneal Copper Foil | 11.7um | 17.5um | 35um | 70um | ||
Adhesive | Thermosetting Adhesive | 12.7um | 25.4um | 50.8um | ||
Pressure Sensitive Adhesive | 12.7um | 25.4um | 50.8um | |||
Base Film | Polymide(PI) | 12.7um | 25.4um | 50.8um | 76.2um | |
Polyester(PET) | 12.7um | 25.4um | 50.8um | 76.2um | ||
Solder Mask | Coverlay | Polymide(PI) | 12.7um | 25.4um | 50.8um | |
Polyester(PET) | 12.7um | 25.4um | 50.8um | |||
Adhesive | Thermosetting Adhesive | 12.7um | 25.4um | 50.8um | ||
Pressure Sensitive Adhesive | 12.7um | 25.4um | 50.8um | |||
SolderMask | UV Cure | 10um — 20um | ||||
Thermal Post Cure | 10um — 20um | |||||
Stiffener | Material | FR4 | 200um-1600um | |||
Polymide(PI) | 12.7um | 25.4um | 50.8um | |||
Polyester(PET) | 2.54um | 3.81um | 4.78um | |||
Stainless Steel | 150um | 200um | ||||
Adhesive | Thermosetting Adhesive | 12.7um | 25.4um | 50.8um | ||
Pressure Sensitive Adhesive | 12.7um | 25.4um | 50.8um | |||
TECHNOLOGY SPECIFICATIONS | ||||||
Process | Item | Size & Thickness | Tolerance & Remarks | |||
Drill | Min hole size (mechanical) | 0.15mm | ±0.05mm(H≤1.5mm) | |||
Min hole size (laser) | <0.15mm | |||||
Min hole size (punch) | 0.50mm | ±0.05mm(H≤1.5mm) | ||||
Pattern Transfer |
Min line width | 0.05mm | ±0.02mm(W≤0.05mm) | |||
Min line gap | 0.05mm | ±0.02mm(W≤0.05mm) | ||||
Panel | Max board size | 250*500mm | ±0.07mm(L≤50mm) | |||
Surface Treatment |
Flash Gold | 0.2um — 3um | ||||
Immersion Gold | 0.025 — 0.075mm | |||||
Tin Plating | 0.2um — 10um | |||||
Immersion Tin | 0.025um — 0.075um | |||||
Tin/lead Plating | 0.05um — 10um | |||||
OSP | 0.2um — 0.5um | |||||
HAL | 0.075um — 5um | |||||
Parameter | Insulation Resistance | 1000m | IPC-TM-650.2.6.3.2 | |||
Dielectric Strength | 5KV | IPC-TM-650.2.5.6.1 | ||||
Surface Resistance | 5*1012Ω ‖ 5*1015Ω | IPC-TM-650.2.5.17 | ||||
Body Resistance Value | 1*1015Ω ‖ 1*1015Ω | IPC-TM-650.2.5.17 | ||||
Dielectric Constant | 4.0 ‖ 3.0 | MIL-P-55617 | ||||
Transpiration Coefficient | 0.04 ‖ 0.03 | MIL-P-55617 | ||||
Peeling Strength | 1.0 kg f/cm ‖ 1.2 kg f/cm | IPC-TM-650.2.4.9 | ||||
Solder Heat Resistance | 300 ℃/10sec ‖ 210 ℃/10sec | |||||
Flammability Retardant | 94VTM-O ‖ 94VTM-O | U194 |