PCB Assembly Services Capabilities
PCB Assembly Services Capability, PCB Manufacturing Capability, Flexible Printed Circuit FPC Capability As follow:
| PCB Assembly Services Capability | ||
| Items | PCB Assembly Services Capability | |
| 1 | Min. IC Pitch | 0.30mm(12mil) |
| 2 | Foot Pin | SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA |
| 3 | Min. Chip Placement | 01005 |
| 4 | Max. PCB Size | 410mm x 600mm(16.2″ x 23.6″) |
| 5 | Min. PCB Thickness | 0.35mm(13.8mil) |
| 6 | Maximum BGA Size | 74mm x 74mm(2.9″ x 2.9″) |
| 7 | BGA Ball Pitch | 1mm ~ 3mm(4mil ~ 12mil) |
| 8 | BGA Ball Diameter | 0.4mm ~ 1mm(16mil ~ 40mil) |
| 9 | QFP Lead Pitch | 0.38mm ~ 2.54mm(15mil ~ 100mil) |
| 10 | Package | Anti-static Bubble Bag & Carton |
| PCB Manufacturing Capability | ||
| Items | Capability | |
| 1 | Layers | 1 ~ 60 layers |
| 2 | Base Material | FR4, High Tg FR4, Halogen Free, Isola, Rogers, Aluminium |
| 3 | Finished Board Thickness | 0.2mm ~ 8.2mm(8mil-330mil) |
| 4 | Aspect Ratio | 10:1 |
| 5 | Copper Thickness | 1/3oz ~ 7oz |
| 6 | Surface Finishing | HASL, Lead Free HASL, Immersion tin, Immersion gold, Gold plating, Immersion silver, OSP, Carbon, etc. |
| 7 | Max gold plating thickness | 50 microinch |
| 8 | Min. Trace Width/Space | 0.075/0.075mm(3/3mil) HDI PCB (1.2/1.2mil) |
| 9 | Min. Finish Holes Size | 0.1mm(4mil) for laser holes; 0.2mm(8mil) for mechanical holes |
| 10 | Max.Finshed Size | 600mm x 900mm (23.6″ x 35.43″) |
| 11 | Hole Tolerance | PTH:±0.076mm(+/-3mil), NTPH:±0.05mm(+/-2mil) |
| 12 | Soldermask Color | Green, White, Black, Red, Yellow, Blue |
| 13 | Silkscreen Color | White, Black, Yellow, Blue |
| 14 | Impedance Control | +/-10% |
| 15 | Profiling Punching | Routing, V-CUT, Chamfer |
| 16 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
| 17 | Special Holes | Blind/Buried holes, Countersunk holes |
| 18 | Reference Standard | IPC-A-600H Class 2, Class 3 |
| 19 | Certificate | UL, ISO9001, TS16949, ISO 14001, TL 9000, AS9100, ROHS, SGS |
| 20 | Package | Vacuum & Carton |
| Flexible Printed Circuit Capability | ||
| Items | Capability | |
| 1 | Type 2, 3 & 4 | Single-sided, Double-sided, Flex-Rigid PCB Multi-layers (up to 16 layers) |
| 2 | Surface Finishing | HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek) ect. |
| 3 | Base Material | Polyimide(Kapton), Polyester(PET), Acrylic, epoxy & adhesive-less, polyimide flex materials |
| 4 | Copper Foil | ED/RA |
| 5 | Min. Line Width | 0.05mm(2 mil) |
| 6 | Min. Line Spacing | 0.05mm(2 mil) |
| 7 | Min. Hole Size | 0.2mm(8mil) |
| 8 | Max. Board Size | 400mm x 800mm(15.8″ x 31.5″) |
| 9 | Board Thickness | Mini 0.1mm(4mil) – max up to 3.0mm (0.118”) |
| 10 | Min. Solder Mask Thickness | 10um(0.4mil) |
| 11 | Solder Mask Types | Green, Yellow, Black, White, Blue, Red, Clear |
| 12 | Profiling | Punching, Routing, V-cut, Bikini cut, loose leaf construction |
| 13 | Soldering Thermal Resistance | 300°C/10 seconds |
| 14 | Peeling Strength | ≥1.4kg/cm |
| 15 | Surface Resistance | 10 5 mΩ |
| 16 | Insulation Resistance | 10 5 mΩ |
| 17 | Dielectric Strength | 9.8×10 5 v/cm |
| 18 | Flammability | UL-94V-0 |
| 19 | Performance Test | 100% electrical and electricity performance test |