HDI PCB Manufacturing Capability

Asia Pacific Circuits – Advantages of HDI PCB Manufacturing 

1. Quotation for HDI PCB within 24 hours, urgent offer within 2 hours.
2. Rich experiences in HDI PCB back up Foxconn, profesional suggestions from design stage in order to avoid any impracticable design.
3. Rich experience in HDI PCB production.
4. HDI PCB from small series to mass production are all acceptable.



Features of HDI PCB

1. Smaller vias and traces for higher route density and fewer layers.
2. Micro-via patterns for routing channels, potential for fewer layers.
3. Only practical way to design with multiple large BGAs having <0.4 mm pitch.
4. Lowest cost for high density boards.
5. HDI for improved signal and power integrity.
6. Newer materials available of higher performance and lower costs, which are not suitable for standard or sequential lamination.


HDI PCB is the best alternative to high layer-countand expensive standard laminate or sequentially laminated boards.
1. The trend is for higher pin-count and finer pin-pitch. The tipping point will occur when the >1500 pin BGAs use 0.4mm pitch.
The only way to effectively breakout and route multiple instances of these devices on a single board will be with the smaller HDI feature sizes.
2.HDI PCB currently dominates the fabrication technology for handheld and consumer electronics. For large board designs, it will continue to grow.


HDI PCB Structures:

  • 1+N+1 – PCBs contain 1 “build-up” of high-density interconnection layers.
  • i+N+i (i≥2) – PCBs contain 2 or more “build-up” of high density interconnection layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in demanding designs.
  • Any Layer HDI PCB – All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures. This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.

Advanced Capabilities:

  • Any layer HDI PCB.
  • Multilayer copper filled stacked micro via structure.
  • Stacked Microvias / Via in pad.
  • UL Recognized / Copper & epoxy hole fill / Via on hole / FCV.
  • 0.4 mm pitch BGA.
  • 3/9 mil laser via capture pad size.
  • Embedded distributed and discrete passive components.
  • Complex rigid-flex HDI products.
  • Wide material and surface finish selections.
PCB Manufacturing Capability of HDI PCB
Base Material FR4, Halogen Free, RCC, Ulta Thin Core
Surface Treatment ENIG+OSP, ENIG, Carbon+OSP, Immersion Tin, OSP
Min. Line/Spacing 1.5/1.5mil 1.2/1.2mil
Critical Line Width Tolerance 2.5mil±15% 2.0mil±10%
Min.Microvia Drill Size (Laser) 3mil 3mil
Min.Capture/Target  Pad Size 10mil 8mil
Min PTH & Buried Drill Bit 0.20mm 0.20mm
Min. Annular Ring 3.5mil 3mil
Max. PTH Aspect Ratio 10:1 12:1
Max. Microvia Aspect Ratio 0.8:1 0.8:1
Impedance Control ±10% ±7%
Solder Mask Clearance 1.5mil 1.5mil
Solder Mask Web 2.5mil 2.5mil
Min. BGA/CSP pitch 0.4mm 0.4mm
Registration from Layer to Layer 2mil 2mil
Min. dielectric thickness 2mil 1.8mil
Max Board Thickness 1.8mil 2.0mil
PTH Hole Tolerance ±3mil ±2mil
Min. Outline Tolerance ±0.1mm ±0.1mm
Min. Core Thickness 3mil 3mil
Hole Structure Stagger Vias, Stacked Via, Skip Via, Stepped Via, ELIC
HDI PCB Other Technology Carbon Jumper, LDI, DLD, Copper Filled Via, VOP

Our Engineers will review your files and email you an accurate quote in 2 hours.

Regular WIP updates to keep customers informed about manufacturing processes and on time delivery.